Título :	A comparative study of acrylic and epoxy-based adhesives for perovskite solar cells encapsulation
Autor :	Soares, Gabriela A. Bicalho, Izabela S. Hermosa, Sergio Castro Corrêa, Luiza de Q. Miranda, Bárbara H. S. Marques, Adriano dos S. Fernandes, Silvia L. Cunha, Thainá Freitas, Vinícius V. de Vilaça, Rodrigo de Q. Wouk, Luana Cristina Bagnis, Diego
metadata.dc.identifier.orcid:	https://orcid.org/0000-0002-1261-5737 https://orcid.org/0000-0001-6933-6352
metadata.dc.contributor.affiliation:	Oninn, Printed Electronics Department Oninn, Printed Electronics Department Universidade Estadual Paulista Julio de Mesquita Filho, Faculdade de Ciências Oninn, Printed Electronics Department Oninn, Printed Electronics Department Oninn, Printed Electronics Department Oninn, Printed Electronics Department University of Brasilia, Institute of Physics Oninn, Printed Electronics Department Universidad El Bosque, Facultad de Ingeniería, Grupo de investigación OSIRIS&BIOAXIS Oninn, Printed Electronics Department Oninn, Printed Electronics Department Oninn, Printed Electronics Department Oninn, Printed Electronics Department Oninn, Printed Electronics Department
Assunto::	Epóxi Encapsulamento Energia solar fotovoltaica Células solares de perovskita
Fecha de publicación :	may-2024
Editorial :	Elsevier BV
Citación :	SOARES, Gabriela A. et al. A comparative study of acrylic and epoxy-based adhesives for perovskite solar cells encapsulation. Solar Energy, [S. l.], v. 273, 112496, 2024. DOI: https://doi.org/10.1016/j.solener.2024.112496. Disponível em: https://www.sciencedirect.com/science/article/pii/S0038092X24001907?via%3Dihub. Acesso em: 25 ago. 2026.
Abstract:	The development of a reliable encapsulation is a key factor for protecting perovskite solar cells from extrinsic degradation and an important step to commercialization. The use of edge sealing materials has already been proven effective for rigid substrates. However, for flexible devices, a different encapsulation strategy must be developed. In this study, epoxy- and acrylic-based adhesives were tested over blade-coated p-i-n MAPI devices and the encapsulation was evaluated with current–voltage measurements, calcium, and thermal stability tests. Although causing discoloration around the cells, over the area without the evaporated top electrode, the epoxy adhesive showed great performance after encapsulation and under thermal stress. This strategy was used to compare the stability of PEDOT:PSS and NiO as HTL. After an initial drop of 40 % in performance, the device with NiO was stable for over 5500 h under 85 °C. These results show that this method can be used for evaluating the stability of perovskite solar cell and that, with further development of a proper buffer layer, epoxy-based adhesives are an effective strategy for flexible encapsulation.
metadata.dc.description.unidade:	Instituto de Física (IF)
DOI:	https://doi.org/10.1016/j.solener.2024.112496
metadata.dc.relation.publisherversion:	https://www.sciencedirect.com/science/article/pii/S0038092X24001907?via%3Dihub
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